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// Industrial COM Solutions

Rugged Industrial Computer-On-Module (COM) Solutions

Made-in-USA COM Express modules and carriers for faster, lower-risk system design.

// Embedded COM solutions

Faster development, lower risk

System designers are asked to develop faster, connect more, keep products in service longer and reduce cost and risk — all while securing a reliable supply chain.

Computer-on-module solutions answer each of those challenges.

Close-up of a computer module circuit board

// Proven and flexible

What is a computer-on-module?

A COM is a mezzanine design: the CPU, memory and basic I/O live on a module that plugs into a carrier board through a standardized connector. The complex computing core is separated from the application-specific I/O on each carrier.

  • Shorter design cycles
  • Performance scalability — swap modules, keep the carrier
  • Reduced single-source risk
  • Extended product service life
  • Lower-cost prototyping

// COM Express

WINSYSTEMS made-in-USA COM Express modules

Of the main module standards — COM Express, SMARC and Qseven — WINSYSTEMS aligns with the PICMG COM Express standard.

COM Express Type 10 Mini

Small size and a widely used pinout, based on Intel Atom® E3900 series processors.

COM Express Type 6 Compact (COMET6-1100)

Higher-performance processors, plus a development kit to start evaluation quickly.

About COM Express standards

Module sizeDimensionsConnector
Mini84 × 55 mm220 pins (Type 10)
Compact95 × 95 mm440 pins (Type 6 / 7)
Basic125 × 95 mm440 pins (Type 6 / 7)
Extended155 × 110 mm440 pins (Type 6 / 7)

View COMs and Carriers

// Applications

Market applications

  • Industrial automation, IIoT and edge computing
  • Machine learning and AI
  • Robotics and drones (UAVs, UMVs)
  • Medical diagnostics and equipment
  • Military and COTS
  • Transportation
  • Energy
  • Test and measurement

// Why WINSYSTEMS

Why WINSYSTEMS rugged industrial COM modules

Accelerated product development

Attach a COM Express module to a custom carrier and focus on the features that differentiate you.

Simpler, more secure upgrades

USA-designed and built, TPM 2.0 on most modules — upgrade without redesigning the carrier.

Reduced development risk

Form/fit/function compatibility and deep BIOS customization experience.

Long-term availability

Designed for harsh environments, extended temperatures and long life cycles.

// questions

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2890 112th Street
Grand Prairie, Texas 75050

// Start a project

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Talk with an application engineer about your next rugged embedded design.